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DEMINERALIZED BONE MATRIX PUTTY CONTAINING BONE CHIPS

VIA DBM Plus™ is a demineralized bone matrix putty containing cortical bone chips and indicated for use in the extremities, posterolateral spine, and pelvis as a bone void filler or for treatment of osseous defects.

Equivalent to iliac crest autograft
proven in a preclinical spinal fusion model1
Assured osteoinductivity
via validated processing
Cohesive handling
Resists irrigation due to robust biocompatible carrier

VIA DBM Plus™ combines demineralized cortical chips (1-4mm) with the proven formulation of VIA DBM Putty™, eliminating the need for cumbersome intra-operative mixing. Utilizing demineralized instead of mineralized cortical chips ensures that the additional graft material does not diminish osteoinductivity. VIA DBM Plus has excellent handling properties and a 510(k) designation from the FDA.

PRODUCT INFORMATION
Preparation Time
None. Product is provided pre-mixed and ready-to-use.
Shelf life
Up to 3 years (at ambient temperature of 15°C to 30°C)
Product Composition
Cortical demineralized bone and a carboxymethyl cellulose (CMC) carrier plus demineralized cortical chips (1-4mm)
Final Preparation
Final product is provided in a ready-to-use syringe.
ORDERING INFORMATION
SIZE
CODE
3.0cc
VX-EP3
5.0cc
VX-EP5
10.0cc
VX-EP10
REFERENCE
1Kiely, P.D. et al., (2014) Evaluation of a new formulation of demineralized bone matrix putty in a rabbit posterolateral spinal fusion model. The Spine Journal. September 14(9): 2155-2163.
For more information on our VIA DBM Plus™ product,
download our brochure.